Advanced condensation re-flow machine for vaporization

                     In condensation reflow soldering, or vapor-segment soldering, soldering is achieved using a hot vapor. Warmness switch in condensation soldering is up to 10 instances higher than in convection soldering. This makes it in particular suitable for processing big or excessive-mass forums in a solid manner atmosphere. Our condenso collection can solder even the most difficult assemblies quickly and dependably, at temperatures up to 240°c. Which will improve manipulate of the condensation phase, rehm has advanced a patented injection process that permits the soldering system to be individually regulated.

             An optional vacuum module guarantees void-loose soldered joints directly after the soldering system or as a pre-vacuum. Our structures assist you to regulate all parameters, inclusive of strain or temperature, flexibly for the fine soldering consequences that precisely match the necessities of your production. The condenso series machine variations can be incorporated into a huge range of manufacturing environments in Tridentent Singapore. Whether or not it’s a batch operation, inline connection or continuous soldering, rehm gives the best degree of system reliability for all areas. Furthermore, through the pre-vacuum, the oxygen of the chamber is replaced with nitrogen, vacuum as much as putting off oxidation.


        The utility alternatives for thecondenso series are as various as their production. We would be happy to determine the most green gadget for your production procedure, taking all applicable approaches which includes throughput, assembly length, thermal mass and follow-up techniques under consideration. With the vacuum option for void-loose (hollow space-loose) soldering with unleaded solders, the condenso structures additionally meet an crucial requirement for manufacturing energy electronics. Lower void quotes can handiest be accomplished with soldering techniques in which the molten solder is subjected to a vacuum. This is also the case for the condenso collection. 

        Ders is an crucial prerequisite for the manufacturing of strength electronics. However, minimal void rates are only possible with soldering procedures which difficulty the molten solder to a vacuum, making it simpler for any remaining residues to escape from the solder joints. For this reason, the condenso can be geared up with a vacuum pump upon request by Tridentent Singapore. This consequences in solder joints with floor touch ratios of extra than ninety nine% in many cases. In addition to the vacuum procedure during the melting segment, vacuum can also be implemented before starting with the soldering manner itself. This permits now not best an uniformly injection of the galden but the evaporation of the solvents of the paste. read more...

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